Traveling-wave photomixers fabricated on high energy nitrogen-ion-implanted GaAs

in Applied Physics Letters (2006), 89(7), 071103

The authors report on fabrication and measurement of traveling-wave photomixers based on high energy and low dose nitrogen-ion-implanted GaAs. They used 3 MeV energy to implant N+ ions into GaAs ... [more ▼]

The authors report on fabrication and measurement of traveling-wave photomixers based on high energy and low dose nitrogen-ion-implanted GaAs. They used 3 MeV energy to implant N+ ions into GaAs substrates with an ion concentration dose of 3 1012 cm−2. The N+-implanted GaAs photomixers exhibit improvements in the output power in comparison with their counterparts, photomixers fabricated on low-temperature-grown GaAs. The maximal output power was 2.64 W at 850 GHz. No saturation of the output power with increased bias voltage and optical input power was observed. These characteristics make N+-implanted GaAs the material of choice for efficient high power sources of terahertz radiation. [less ▲]

Ultrafast metal-semiconductor-metal photodetectors on low-temperature-grown GaN

in Applied Physics Letters (2005), 86(21), 211110

We have fabricated and characterized ultrafast metal-semiconductor-metal photodetectors based on low-temperature-grown sLTd GaN. The photodetector devices exhibit up to 200 kV/cm electric breakdown fields ... [more ▼]

We have fabricated and characterized ultrafast metal-semiconductor-metal photodetectors based on low-temperature-grown sLTd GaN. The photodetector devices exhibit up to 200 kV/cm electric breakdown fields and subpicosecond carrier lifetime. We recorded as short as 1.4-ps-wide electrical transients using 360-nm-wavelength and 100-fs-duration laser pulses, that is corresponding to the carrier lifetime of 720 fs in our LT GaN material. [less ▲]

Photomixers fabricated on nitrogen-ion-implanted GaAs

in Applied Physics Letters (2005), 87(4), 41106-1-3

We report on fabrication and measurement of photomixers based on nitrogen-ion-implanted GaAs. We used energies of 500 keV, 700 keV, and 880 keV to implant N+ ions into GaAs substrates with an ion ... [more ▼]

We report on fabrication and measurement of photomixers based on nitrogen-ion-implanted GaAs. We used energies of 500 keV, 700 keV, and 880 keV to implant N+ ions into GaAs substrates with an ion concentration of 3 1012 cm−2. The resulting material exhibited 110 fs carrier lifetime due to implantation-induced defects. Our photomixers were fabricated as metal-semiconductor-metal devices, placed at the feed point of a broadband antenna. Optoelectronic measurements were performed in the wavelength range between 350 nm and 950 nm. In comparison to their counterparts photomixers fabricated on low-temperature-grown GaAs the N+-implanted GaAs photomixers exhibit improvements on both the output power and responsivity. A maximal responsivity of above 100 mA/W was achieved and we did not observe any dependence of the mixer cut-off frequency on the bias voltage. These characteristics make N+-implanted GaAs the material of choice for efficient optoelectronic photomixers. [less ▲]

Growth and properties of GaN and AlN layers on silver substrates

in Applied Physics Letters (2005), 87

We report on the preparation and properties of GaN and AlN layers grown by molecular-beam epitaxy on silver metal substrates. X-ray diffraction rocking curves show polycrystalline character of GaN with ... [more ▼]

We report on the preparation and properties of GaN and AlN layers grown by molecular-beam epitaxy on silver metal substrates. X-ray diffraction rocking curves show polycrystalline character of GaN with high preferential GaN 11-22 orientation. An intermetallic phase of Ga3Ag is found at the GaN/Ag interface. On the other hand, AlN layers exhibit a monocrystalline structure with a growth direction of 0002 . Schottky diodes prepared on GaN layers show good rectifying behavior and relatively low leakage current 10−3 A/cm2 . These results indicate that the III-nitride growth on metallic substrates might be used for low-cost and large-area electronic and photonic devices. [less ▲]

High-power SiO2/AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors

in Applied Physics Letters (2005), 87(14), 143501-143504

We report on SiO2 /AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors MOSHFETs , which exhibit a 6.7 W/mm power density at 7 GHz. Unpassivated and SiO2-passivated heterostructure ... [more ▼]

We report on SiO2 /AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors MOSHFETs , which exhibit a 6.7 W/mm power density at 7 GHz. Unpassivated and SiO2-passivated heterostructure field-effect transistors HFETs were also investigated for comparison. Deposited 12 nm thick SiO2 yielded an increase of the sheet carrier density from 7.6 .10^12 to 9.2 .10^12 cm−2 and a subsequent increase of the static drain saturation current from 0.75 to 1.09 A/mm. The small-signal rf characterization of the MOSHFETs showed an extrinsic current gain cutoff frequency fT of 24 GHz and a maximum frequency of oscillation fmax of 40 GHz. The output power of 6.7 W/mm of the MOSHFETs measured at 7 GHz is about two times larger than that of HFETs. The results obtained demonstrate the suitability of GaN-based MOSHFETs for high-power electronics. [less ▲]

Influence of carrier supply doping on the RF properties of AlGaN/GaN/SiC high-electron-mobility transistors

in Physica Status Solidi C. Current Topics in Solid State Physics (2005), 2(7), 2611-2614

We have fabricated undoped as well as modulation-doped AlGaN/GaN HEMTs on SiC substrate. The influence of the carrier supply layer on device performance is investigated by Hall, channel conductivity ... [more ▼]

We have fabricated undoped as well as modulation-doped AlGaN/GaN HEMTs on SiC substrate. The influence of the carrier supply layer on device performance is investigated by Hall, channel conductivity, small signal RF and delay time evaluation. While the doping layer improves the DC performance it degrades the RF behaviour of the device with the highest carrier supply doping of 5x1018 cm–3. The channel conductivity measurements show identical dependence of the mobility on carrier concentration for all samples. The saturation velocity, extracted by evaluation of the total delay time as function of the inverse drain current, decreases from 0.86x107 cm/s for the undoped device to 0.7x107 cm/s for the highest doped HEMT. This result shows that the degradation of RF performance is due to the reduction of the effective saturation velocity caused by the carrier supply layer. [less ▲]

SiO2 /AlGaN/GaN MOSHFET with 0.7 µm gate-length and fmax / fT of 40/24 GHz

in Electronics Letters (2005), 41(11), 667-668

The performance of SiO2/AlGaN/GaN MOSHFETs is described. The C–V measurements showed slight increase in sheet carrier density after applying 12 nm-thick PECVD SiO2. The devices exhibited gate leakage ... [more ▼]

The performance of SiO2/AlGaN/GaN MOSHFETs is described. The C–V measurements showed slight increase in sheet carrier density after applying 12 nm-thick PECVD SiO2. The devices exhibited gate leakage current of 5 .10 ^-10 A/mm. Small-signal RF characterisation of 0.7 mm gate length devices yielded an fT of 24 GHz and an fmax of 40 GHz, which are comparable to those typical for state-of-the-art AlGaN/GaN HFETs. [less ▲]

Large-area traveling-wave LT-GaAs photomixers for LO application

in SPIE (2004), 5498 (2004)

An optimization of terahertz local oscillators based on LT-GaAs technology

in SPIE (2004), 5498 (2004)

Influence of a carrier supply layer on carrier density and drift mobility of AlGaN/GaN/SiC high-electron-mobility transistors

in Applied Physics Letters (2004), 84 (2004)

Sheet carrier concentration and low-field drift mobility of intentionally undoped and modulation-doped AlGaN/GaN heterostructures on SiC substrate were evaluated by capacitance-voltage and channel ... [more ▼]

Sheet carrier concentration and low-field drift mobility of intentionally undoped and modulation-doped AlGaN/GaN heterostructures on SiC substrate were evaluated by capacitance-voltage and channel conductivity measurements. Sheet carrier concentration and average mobility at 0 V gate bias correspond to standard Hall results. Sheet carrier density increases from 6.831012 cm22 for the undoped sample up to 131013 cm22 for the device with the highest doping concentration, while the mobility decreases from 1800 to 1620 cm2/V s. The local mobility, on the other hand, depends only on the actual sheet carrier density and is not influenced by the doping concentration of the carrier supply layer. It reaches a maximum value of 2100 cm2/Vs at a carrier density of 331012 cm22. [less ▲]